Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Review

Recently, research into the factors that influence the formation and growth of intermetallic compounds (IMCs) layer in lead-free solders has piqued interest, as IMCs play an important role in solder joints. The reliability of solder joints is critical to the long-term performance of electronic produ...

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Detalles Bibliográficos
Autores principales: Ramli, Mohd Izrul Izwan, Salleh, Mohd Arif Anuar Mohd, Abdullah, Mohd Mustafa Al Bakri, Zaimi, Nur Syahirah Mohamad, Sandu, Andrei Victor, Vizureanu, Petrica, Rylski, Adam, Amli, Siti Farahnabilah Muhd
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Review
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8875696/
https://www.ncbi.nlm.nih.gov/pubmed/35207990
http://dx.doi.org/10.3390/ma15041451

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8875696/
https://www.ncbi.nlm.nih.gov/pubmed/35207990
http://dx.doi.org/10.3390/ma15041451

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