Modeling and Measurement of Thermal–Mechanical-Stress-Creep Effect for RF MEMS Switch Up to 200 °C

High-temperature processes, such as packaging and annealing, are challenges for Radio-Frequency Micro-Electro-Mechanical-Systems (RF MEMS) structures, which could lead to device failure. Coefficient of thermal expansion (CTE) mismatch and the material’s creep effect affect the fabrication and perfor...

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Detalles Bibliográficos
Autores principales: Zhang, Yulong, Sun, Jianwen, Liu, Huiliang, Liu, Zewen
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8876270/
https://www.ncbi.nlm.nih.gov/pubmed/35208291
http://dx.doi.org/10.3390/mi13020166

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8876270/
https://www.ncbi.nlm.nih.gov/pubmed/35208291
http://dx.doi.org/10.3390/mi13020166

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