The Stability and Electronic Structure of Cu(200)/AuCu(200) Interface: An Insight from First-Principle Calculation

AuCu phase had a significant effect on the bonding strength of Au80Sn20 alloy and Cu substrate. The formation of the AuCu(200)/Cu(200) interface significantly improves the shear strength of solder joints. Therefore, it is particularly important to analyze the strengthening mechanism of the AuCu phas...

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Detalles Bibliográficos
Autores principales: Li, Zihao, Feng, Junli, Wu, Zhangxi, Pang, Mingjun, Liu, Dong, Yang, Wenchao, Zhan, Yongzhong
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8878266/
https://www.ncbi.nlm.nih.gov/pubmed/35208041
http://dx.doi.org/10.3390/ma15041506

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8878266/
https://www.ncbi.nlm.nih.gov/pubmed/35208041
http://dx.doi.org/10.3390/ma15041506

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