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The Stability and Electronic Structure of Cu(200)/AuCu(200) Interface: An Insight from First-Principle Calculation
AuCu phase had a significant effect on the bonding strength of Au80Sn20 alloy and Cu substrate. The formation of the AuCu(200)/Cu(200) interface significantly improves the shear strength of solder joints. Therefore, it is particularly important to analyze the strengthening mechanism of the AuCu phas...
Autores principales: | Li, Zihao, Feng, Junli, Wu, Zhangxi, Pang, Mingjun, Liu, Dong, Yang, Wenchao, Zhan, Yongzhong |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2022
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8878266/ https://www.ncbi.nlm.nih.gov/pubmed/35208041 http://dx.doi.org/10.3390/ma15041506 |
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