Characteristics of Cracking Failure in Microbump Joints for 3D Chip-on-Chip Interconnections under Drop Impact

With the rapid development of microelectronics packaging and integration, the failure risk of micro-solder joints in packaging structure caused by impact load has been increasingly concerning. However, the failure mechanism and reliability performance of a Cu-pillar-based microbump joint can use lit...

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Detalles Bibliográficos
Autores principales: Liu, Zhen, Fang, Mingang, Shi, Lei, Gu, Yu, Chen, Zhuo, Zhu, Whenhui
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8879802/
https://www.ncbi.nlm.nih.gov/pubmed/35208406
http://dx.doi.org/10.3390/mi13020281

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8879802/
https://www.ncbi.nlm.nih.gov/pubmed/35208406
http://dx.doi.org/10.3390/mi13020281

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