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Characteristics of Cracking Failure in Microbump Joints for 3D Chip-on-Chip Interconnections under Drop Impact
With the rapid development of microelectronics packaging and integration, the failure risk of micro-solder joints in packaging structure caused by impact load has been increasingly concerning. However, the failure mechanism and reliability performance of a Cu-pillar-based microbump joint can use lit...
| Autores principales: | , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2022
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8879802/ https://www.ncbi.nlm.nih.gov/pubmed/35208406 http://dx.doi.org/10.3390/mi13020281 |