Study of New Nitrogen-Fireable Copper-Nickel Thick Film Paste Formulation Compatible with Thick Printed Copper

This paper is focused on a new copper-nickel thick film resistive paste which was designed and experimentally developed for the realization of low-ohmic power resistors. This copper-nickel paste has been designed for use in combination with thick printed copper conductors and in comparison with conv...

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Detalles Bibliográficos
Autores principales: Hlina, Jiri, Reboun, Jan, Simonovsky, Marek, Syrovy, Tomas, Janda, Martin, Hamacek, Ales
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8880794/
https://www.ncbi.nlm.nih.gov/pubmed/35207913
http://dx.doi.org/10.3390/ma15041372

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8880794/
https://www.ncbi.nlm.nih.gov/pubmed/35207913
http://dx.doi.org/10.3390/ma15041372

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