Investigation of Warpage for Multi-Die Fan-Out Wafer-Level Packaging Process

This paper focuses on characterizing the evolution of warpage, effects of epoxy molding compound (EMC), and effects of carrier 2 (the second carrier in the process) of 12 inch RDL-first multi-die fan-out wafer-level packaging (FOWLP) during the manufacturing process. The linear viscoelasticity prope...

Descripción completa

Detalles Bibliográficos
Autores principales: Chen, Chuan, Su, Meiying, Ma, Rui, Zhou, Yunyan, Li, Jun, Cao, Liqiang
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8911451/
https://www.ncbi.nlm.nih.gov/pubmed/35268913
http://dx.doi.org/10.3390/ma15051683

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8911451/
https://www.ncbi.nlm.nih.gov/pubmed/35268913
http://dx.doi.org/10.3390/ma15051683

Ejemplares similares