Metallization on Sapphire and Low-Temperature Joining with Metal Substrates

To meet the packaging requirements of sapphire in special electronic components, there is an urgent need for a joining process that can realize a good connection between sapphire and dissimilar metals at a low temperature. In this work, the surface of a sapphire substrate was successfully catalytica...

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Detalles Bibliográficos
Autores principales: Fang, Jiajun, Zhang, Qiaoxin, Luo, Zhou, Huang, Wei, Liu, Zhenyu, Chen, Zhiwen, Cao, Xueqiang, Liu, Li
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8911776/
https://www.ncbi.nlm.nih.gov/pubmed/35269014
http://dx.doi.org/10.3390/ma15051783

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8911776/
https://www.ncbi.nlm.nih.gov/pubmed/35269014
http://dx.doi.org/10.3390/ma15051783

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