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Metallization on Sapphire and Low-Temperature Joining with Metal Substrates
To meet the packaging requirements of sapphire in special electronic components, there is an urgent need for a joining process that can realize a good connection between sapphire and dissimilar metals at a low temperature. In this work, the surface of a sapphire substrate was successfully catalytica...
Autores principales: | , , , , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2022
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8911776/ https://www.ncbi.nlm.nih.gov/pubmed/35269014 http://dx.doi.org/10.3390/ma15051783 |
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author | Fang, Jiajun Zhang, Qiaoxin Luo, Zhou Huang, Wei Liu, Zhenyu Chen, Zhiwen Cao, Xueqiang Liu, Li |
author_facet | Fang, Jiajun Zhang, Qiaoxin Luo, Zhou Huang, Wei Liu, Zhenyu Chen, Zhiwen Cao, Xueqiang Liu, Li |
author_sort | Fang, Jiajun |
collection | PubMed |
description | To meet the packaging requirements of sapphire in special electronic components, there is an urgent need for a joining process that can realize a good connection between sapphire and dissimilar metals at a low temperature. In this work, the surface of a sapphire substrate was successfully catalytically activated and metallized by an electroless nickel plating process. Moreover, the solderability and interconnection of metallized sapphire with Sn-based solders were evaluated and investigated at 250 °C, and the wetting angle of the Sn-based solders on sapphire on sapphire without and with metallization was 125° and 51°, respectively. The interfacial microscopic morphology and element distribution in the Cu/Sn-Ag solder/sapphire solder joints were analyzed. It was found that the middle solder layer has diffused during the reflow process, inferring good adhesion between sapphire and Cu substrate with the aid of the Ni-P deposition. Thus, a sapphire welding method with a simple process suitable for practical applications is demonstrated. |
format | Online Article Text |
id | pubmed-8911776 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2022 |
publisher | MDPI |
record_format | MEDLINE/PubMed |
spelling | pubmed-89117762022-03-11 Metallization on Sapphire and Low-Temperature Joining with Metal Substrates Fang, Jiajun Zhang, Qiaoxin Luo, Zhou Huang, Wei Liu, Zhenyu Chen, Zhiwen Cao, Xueqiang Liu, Li Materials (Basel) Article To meet the packaging requirements of sapphire in special electronic components, there is an urgent need for a joining process that can realize a good connection between sapphire and dissimilar metals at a low temperature. In this work, the surface of a sapphire substrate was successfully catalytically activated and metallized by an electroless nickel plating process. Moreover, the solderability and interconnection of metallized sapphire with Sn-based solders were evaluated and investigated at 250 °C, and the wetting angle of the Sn-based solders on sapphire on sapphire without and with metallization was 125° and 51°, respectively. The interfacial microscopic morphology and element distribution in the Cu/Sn-Ag solder/sapphire solder joints were analyzed. It was found that the middle solder layer has diffused during the reflow process, inferring good adhesion between sapphire and Cu substrate with the aid of the Ni-P deposition. Thus, a sapphire welding method with a simple process suitable for practical applications is demonstrated. MDPI 2022-02-26 /pmc/articles/PMC8911776/ /pubmed/35269014 http://dx.doi.org/10.3390/ma15051783 Text en © 2022 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). |
spellingShingle | Article Fang, Jiajun Zhang, Qiaoxin Luo, Zhou Huang, Wei Liu, Zhenyu Chen, Zhiwen Cao, Xueqiang Liu, Li Metallization on Sapphire and Low-Temperature Joining with Metal Substrates |
title | Metallization on Sapphire and Low-Temperature Joining with Metal Substrates |
title_full | Metallization on Sapphire and Low-Temperature Joining with Metal Substrates |
title_fullStr | Metallization on Sapphire and Low-Temperature Joining with Metal Substrates |
title_full_unstemmed | Metallization on Sapphire and Low-Temperature Joining with Metal Substrates |
title_short | Metallization on Sapphire and Low-Temperature Joining with Metal Substrates |
title_sort | metallization on sapphire and low-temperature joining with metal substrates |
topic | Article |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8911776/ https://www.ncbi.nlm.nih.gov/pubmed/35269014 http://dx.doi.org/10.3390/ma15051783 |
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