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Metallization on Sapphire and Low-Temperature Joining with Metal Substrates
To meet the packaging requirements of sapphire in special electronic components, there is an urgent need for a joining process that can realize a good connection between sapphire and dissimilar metals at a low temperature. In this work, the surface of a sapphire substrate was successfully catalytica...
| Autores principales: | , , , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2022
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8911776/ https://www.ncbi.nlm.nih.gov/pubmed/35269014 http://dx.doi.org/10.3390/ma15051783 |