Cargando…

Low-Temperature Cu/SiO(2) Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces

We adopted (111)-oriented Cu with high surface diffusivity to achieve low-temperature and low-pressure Cu/SiO(2) hybrid bonding. Electroplating was employed to fabricate arrays of Cu vias with 78% (111) surface grains. The bonding temperature can be lowered to 200 °C, and the pressure is as low as 1...

Descripción completa

Detalles Bibliográficos
Autores principales:	Ong, Jia-Juen, Chiu, Wei-Lan, Lee, Ou-Hsiang, Chiang, Chia-Wen, Chang, Hsiang-Hung, Wang, Chin-Hung, Shie, Kai-Cheng, Yang, Shih-Chi, Tran, Dinh-Phuc, Tu, King-Ning, Chen, Chih
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2022
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8911830/ https://www.ncbi.nlm.nih.gov/pubmed/35269118 http://dx.doi.org/10.3390/ma15051888

Ejemplares similares

Measurement of Thermal Stress by X-ray Nano-Diffraction in (111)-Oriented Nanotwinned Cu Bumps for Cu/SiO(2) Hybrid Joints
por: Hsu, Wei-You, et al.
Publicado: (2023)

Enhancement of fatigue resistance by recrystallization and grain growth to eliminate bonding interfaces in Cu–Cu joints
por: Ong, Jia-Juen, et al.
Publicado: (2022)

Interfacial Characterization of Low-Temperature Cu-to-Cu Direct Bonding with Chemical Mechanical Planarized Nanotwinned Cu Films
por: Lin, Po-Fan, et al.
Publicado: (2022)

Intermediate Cu-O-Si Phase in the Cu-SiO(2)/Si(111) System: Growth, Elemental, and Electrical Studies
por: Sreedharan, Reshmi, et al.
Publicado: (2021)

Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned Cu
por: Juang, Jing-Ye, et al.
Publicado: (2018)

Effect of grain orientations of Cu seed layers on the growth of <111>-oriented nanotwinned Cu
por: Liu, Chien-Min, et al.
Publicado: (2014)

Comparison of oxidation in uni-directionally and randomly oriented Cu films for low temperature Cu-to-Cu direct bonding
por: Tseng, Chih-Han, et al.
Publicado: (2018)

Recrystallization and Grain Growth in Cu-Cu Joints under Electromigration at Low Temperatures
por: Yang, Shih-Chi, et al.
Publicado: (2023)

Failure Mechanisms of Cu–Cu Bumps under Thermal Cycling
por: Shie, Kai-Cheng, et al.
Publicado: (2021)

Failures of Cu-Cu Joints under Temperature Cycling Tests
por: Hsu, Po-Ning, et al.
Publicado: (2022)

Low-Temperature and Low-Pressure Cu–Cu Bonding by Highly Sinterable Cu Nanoparticle Paste
por: Li, Junjie, et al.
Publicado: (2017)

Influence of embedding Cu nano-particles into a Cu/SiO(2)/Pt structure on its resistive switching
por: Liu, Chih-Yi, et al.
Publicado: (2013)

Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu
por: Liu, Chien-Min, et al.
Publicado: (2015)

Investigation of Low-Pressure Sn-Passivated Cu-to-Cu Direct Bonding in 3D-Integration
por: Kung, Po-Yu, et al.
Publicado: (2022)

Comparing Graphene Growth on Cu(111) versus Oxidized Cu(111)
por: Gottardi, Stefano, et al.
Publicado: (2015)

Effect of Cu Ion Concentration on Microstructures and Mechanical Properties of Nanotwinned Cu Foils Fabricated by Rotary Electroplating
por: Hung, Yu-Wen, et al.
Publicado: (2021)

Effect of Bonding Strength on Electromigration Failure in Cu–Cu Bumps
por: Shie, Kai-Cheng, et al.
Publicado: (2021)

Effect of vertically oriented few-layer graphene on the wettability and interfacial reactions of the AgCuTi-SiO(2f)/SiO(2) system
por: Sun, Z., et al.
Publicado: (2017)

Regulation of Cu Species in CuO/SiO(2) and Its Structural Evolution in Ethynylation Reaction
por: Li, Haitao, et al.
Publicado: (2019)

Plasma-assisted oxidation of Cu(100) and Cu(111)
por: Kunze, Sebastian, et al.
Publicado: (2021)

Low Magnetic Field Detection Using a CuPt Nano Structure Made on a SiO(2)/Si Structure
por: Hajghassem, Hassan, et al.
Publicado: (2009)

Cu-Based Thermocompression Bonding and Cu/Dielectric Hybrid Bonding for Three-Dimensional Integrated Circuits (3D ICs) Application
por: Huang, Yuan-Chiu, et al.
Publicado: (2023)

Tensile Properties of <111>-Oriented Nanotwinned Cu with Different Columnar Grain Structures
por: Li, Yu-Jin, et al.
Publicado: (2020)

Vibrational control of selective bond cleavage in dissociative chemisorption of methanol on Cu(111)
por: Chen, Jialu, et al.
Publicado: (2018)

Interface atom mobility and charge transfer effects on CuO and Cu(2)O formation on Cu(3)Pd(111) and Cu(3)Pt(111)
por: Tsuda, Yasutaka, et al.
Publicado: (2021)

Low-Thermal-Budget Photonic Sintering of Hybrid Pastes Containing Submicron/Nano CuO/Cu(2)O Particles
por: Chiu, Po-Hsiang, et al.
Publicado: (2021)

An iridescent film of porous anodic aluminum oxide with alternatingly electrodeposited Cu and SiO(2) nanoparticles
por: Chang, Menglei, et al.
Publicado: (2019)

1,3,5-Benzenetribenzoic Acid on Cu(111) and Graphene/Cu(111): A Comparative STM Study
por: Li, Jun, et al.
Publicado: (2016)

Room-Temperature C–C σ-Bond Activation of Biphenylene Derivatives on Cu(111)
por: Calupitan, Jan Patrick, et al.
Publicado: (2023)

Ceria Promoted Cu-Ni/SiO(2) Catalyst for Selective Hydrodeoxygenation of Vanillin
por: Mukherjee, Deboshree, et al.
Publicado: (2019)

Theoretical Study of the Mechanism of Furfural Conversion on the NiCuCu(111) Surface
por: Shi, Yun
Publicado: (2019)

Low Cost Fabrication of Si NWs/CuI Heterostructures
por: Lo Faro, Maria José, et al.
Publicado: (2018)

Advanced Cu chemical displacement technique for SiO(2)-based electrochemical metallization ReRAM application
por: Chin, Fun-Tat, et al.
Publicado: (2014)

Hydrogen Exchange through Hydrogen Bonding between Methanol and Water in the Adsorbed State on Cu(111)
por: Ben David, Roey, et al.
Publicado: (2023)

Mechanism Investigations on Water Gas Shift Reaction over Cu(111), Cu(100), and Cu(211) Surfaces
por: Li, Zhiyuan, et al.
Publicado: (2022)

Orbital Mapping of Semiconducting Perylenes on Cu(111)
por: Di Santo, Giovanni, et al.
Publicado: (2021)

Temperature effect on the nucleation of graphene on Cu (111)
por: Didar, Behnaz Rahmani, et al.
Publicado: (2018)

Tuning adlayer-substrate interactions of graphene/h-BN heterostructures on Cu(111)–Ni and Ni(111)–Cu surface alloys
por: Huang, Jianmei, et al.
Publicado: (2021)

Moisture effect on the diffusion of Cu ions in Cu/Ta(2)O(5)/Pt and Cu/SiO(2)/Pt resistance switches: a first-principles study
por: Xiao, Bo, et al.
Publicado: (2019)

Low-Temperature In-Induced Holes Formation in Native-SiO(x)/Si(111) Substrates for Self-Catalyzed MBE Growth of GaAs Nanowires
por: R. Reznik, Rodion, et al.
Publicado: (2020)

Cannot write session to /tmp/vufind_sessions/sess_t5dmf20aippjb5u6ja5t8lon6a