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A Novel Feature Extraction Algorithm and System for Flexible Integrated Circuit Packaging Substrate

Aiming at the line defect detection of a flexible integrated circuit substrate (FICS) without reference template, there are some problems such as line discontinuity or inaccurate line defect location in the detection results. In order to address these problems, a line feature detection algorithm for...

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Detalles Bibliográficos
Autores principales: Huang, Dan, Wang, Juan, Zeng, Yong, Yu, Yongxing, Hu, Yueming
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8951624/
https://www.ncbi.nlm.nih.gov/pubmed/35334682
http://dx.doi.org/10.3390/mi13030391
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author Huang, Dan
Wang, Juan
Zeng, Yong
Yu, Yongxing
Hu, Yueming
author_facet Huang, Dan
Wang, Juan
Zeng, Yong
Yu, Yongxing
Hu, Yueming
author_sort Huang, Dan
collection PubMed
description Aiming at the line defect detection of a flexible integrated circuit substrate (FICS) without reference template, there are some problems such as line discontinuity or inaccurate line defect location in the detection results. In order to address these problems, a line feature detection algorithm for extracting an FICS image is proposed. Firstly, FICS image acquisition is carried out by using the appearance defect intelligent detection system independently developed in our lab. Secondly, in the algorithm design of the software system, the binary image of the line image to be segmented is obtained after the color FICS image is classified by K-means, median filtering, morphological filling and closed operation. Finally, for an FICS binary image, an image segmentation model with convexity-preserving indirect regular level set is proposed, which is applied to extract the line features of an FICS image. Experiment results show that, compared with the CV model, LBF model, LCV model, LGIF model, Order-LBF model and RSF model, the proposed model can extract line features with high accuracy, and the line boundary is smooth, which lays an important foundation for high-precision measurement of line width and line distance and high-precision location of defects.
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spelling pubmed-89516242022-03-26 A Novel Feature Extraction Algorithm and System for Flexible Integrated Circuit Packaging Substrate Huang, Dan Wang, Juan Zeng, Yong Yu, Yongxing Hu, Yueming Micromachines (Basel) Article Aiming at the line defect detection of a flexible integrated circuit substrate (FICS) without reference template, there are some problems such as line discontinuity or inaccurate line defect location in the detection results. In order to address these problems, a line feature detection algorithm for extracting an FICS image is proposed. Firstly, FICS image acquisition is carried out by using the appearance defect intelligent detection system independently developed in our lab. Secondly, in the algorithm design of the software system, the binary image of the line image to be segmented is obtained after the color FICS image is classified by K-means, median filtering, morphological filling and closed operation. Finally, for an FICS binary image, an image segmentation model with convexity-preserving indirect regular level set is proposed, which is applied to extract the line features of an FICS image. Experiment results show that, compared with the CV model, LBF model, LCV model, LGIF model, Order-LBF model and RSF model, the proposed model can extract line features with high accuracy, and the line boundary is smooth, which lays an important foundation for high-precision measurement of line width and line distance and high-precision location of defects. MDPI 2022-02-28 /pmc/articles/PMC8951624/ /pubmed/35334682 http://dx.doi.org/10.3390/mi13030391 Text en © 2022 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Huang, Dan
Wang, Juan
Zeng, Yong
Yu, Yongxing
Hu, Yueming
A Novel Feature Extraction Algorithm and System for Flexible Integrated Circuit Packaging Substrate
title A Novel Feature Extraction Algorithm and System for Flexible Integrated Circuit Packaging Substrate
title_full A Novel Feature Extraction Algorithm and System for Flexible Integrated Circuit Packaging Substrate
title_fullStr A Novel Feature Extraction Algorithm and System for Flexible Integrated Circuit Packaging Substrate
title_full_unstemmed A Novel Feature Extraction Algorithm and System for Flexible Integrated Circuit Packaging Substrate
title_short A Novel Feature Extraction Algorithm and System for Flexible Integrated Circuit Packaging Substrate
title_sort novel feature extraction algorithm and system for flexible integrated circuit packaging substrate
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8951624/
https://www.ncbi.nlm.nih.gov/pubmed/35334682
http://dx.doi.org/10.3390/mi13030391
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