A study on the viscosity reduction mechanism of high-filled silicone potting adhesive by the formation of Al(2)O(3) clusters

Heat dissipation has become a key problem for highly integrated and miniaturized electronic components. High thermal conductivity, good flowability and low coefficient of linear thermal expansion (CLTE) are indispensable performance parameters in the field of electronic potting composite materials....

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Detalles Bibliográficos
Autores principales: Wang, Jing, Ma, Haihong, Ren, Fengmei, Zhou, Zhengfa, Xu, Weibing
Formato: Online Artículo Texto
Lenguaje:English
Publicado: The Royal Society of Chemistry 2022
Materias:
Chemistry
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8966715/
https://www.ncbi.nlm.nih.gov/pubmed/35424905
http://dx.doi.org/10.1039/d1ra09417c

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8966715/
https://www.ncbi.nlm.nih.gov/pubmed/35424905
http://dx.doi.org/10.1039/d1ra09417c

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