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A study on the viscosity reduction mechanism of high-filled silicone potting adhesive by the formation of Al(2)O(3) clusters
Heat dissipation has become a key problem for highly integrated and miniaturized electronic components. High thermal conductivity, good flowability and low coefficient of linear thermal expansion (CLTE) are indispensable performance parameters in the field of electronic potting composite materials....
| Autores principales: | , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
The Royal Society of Chemistry
2022
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8966715/ https://www.ncbi.nlm.nih.gov/pubmed/35424905 http://dx.doi.org/10.1039/d1ra09417c |