Direct Bonding Method for Completely Cured Polyimide by Surface Activation and Wetting

Polymer adhesives have emerged as a promising dielectric passivation layer in hybrid bonding for 3D integration, but they raise misalignment problems during curing. In this work, the synergistic effect of oxygen plasma surface activation and wetting is utilized to achieve bonding between completed c...

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Detalles Bibliográficos
Autores principales: Meng, Ying, Gao, Runhua, Wang, Xinhua, Huang, Sen, Wei, Ke, Wang, Dahai, Mu, Fengwen, Liu, Xinyu
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8999792/
https://www.ncbi.nlm.nih.gov/pubmed/35407859
http://dx.doi.org/10.3390/ma15072529

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8999792/
https://www.ncbi.nlm.nih.gov/pubmed/35407859
http://dx.doi.org/10.3390/ma15072529

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