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Direct Bonding Method for Completely Cured Polyimide by Surface Activation and Wetting
Polymer adhesives have emerged as a promising dielectric passivation layer in hybrid bonding for 3D integration, but they raise misalignment problems during curing. In this work, the synergistic effect of oxygen plasma surface activation and wetting is utilized to achieve bonding between completed c...
| Autores principales: | , , , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2022
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8999792/ https://www.ncbi.nlm.nih.gov/pubmed/35407859 http://dx.doi.org/10.3390/ma15072529 |