Reflow Soldering Capability Improvement by Utilizing TaN Interfacial Layer in 1Mbit RRAM Chip

We investigated the thermal stability of a 1Mbit OxRRAM array embedded in 28 nm COMS technology. A back-end-of-line (BEOL) solution with a TaN–Ta interfacial layer was proposed to eliminate the failure rate after reflow soldering assembly at 260 °C. By utilizing a TaN–Ta interfacial layer (IL), the...

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Detalles Bibliográficos
Autores principales: Yuan, Peng, Dong, Danian, Zheng, Xu, Xing, Guozhong, Xu, Xiaoxin
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9025100/
https://www.ncbi.nlm.nih.gov/pubmed/35457872
http://dx.doi.org/10.3390/mi13040567

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9025100/
https://www.ncbi.nlm.nih.gov/pubmed/35457872
http://dx.doi.org/10.3390/mi13040567

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