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Glass Frit Jetting for Advanced Wafer-Level Hermetic Packaging
Glass frit bonding is a widely used technology to cap and seal micro-electromechanical systems on the wafer level using a low melting point glass. Screen printing is the main method to apply glass frit paste on wafers. Screen printing of glass frit paste is usually performed on less sensitive, less...
| Autores principales: | , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2022
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| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9025195/ https://www.ncbi.nlm.nih.gov/pubmed/35454479 http://dx.doi.org/10.3390/ma15082786 |