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Glass Frit Jetting for Advanced Wafer-Level Hermetic Packaging

Glass frit bonding is a widely used technology to cap and seal micro-electromechanical systems on the wafer level using a low melting point glass. Screen printing is the main method to apply glass frit paste on wafers. Screen printing of glass frit paste is usually performed on less sensitive, less...

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Detalles Bibliográficos
Autores principales:	Roshanghias, Ali, Bardong, Jochen, Binder, Alfred
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2022
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9025195/ https://www.ncbi.nlm.nih.gov/pubmed/35454479 http://dx.doi.org/10.3390/ma15082786

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