An Automated Room Temperature Flip-Chip Mounting Process for Hybrid Printed Electronics

Printing technology and mounting technology enable the novel field of hybrid printed electronics. To establish a hybrid printed system, one challenge is that the applied mounting process meets the requirements of functional inks and substrates. One of the most common requirements is low process temp...

Descripción completa

Detalles Bibliográficos
Autores principales: Chen, Zehua, Gengenbach, Ulrich, Liu, Xinnan, Scholz, Alexander, Zimmermann, Lukas, Aghassi-Hagmann, Jasmin, Koker, Liane
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9028054/
https://www.ncbi.nlm.nih.gov/pubmed/35457888
http://dx.doi.org/10.3390/mi13040583

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9028054/
https://www.ncbi.nlm.nih.gov/pubmed/35457888
http://dx.doi.org/10.3390/mi13040583

Ejemplares similares