Effect of Kaolin Geopolymer Ceramics Addition on the Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Joints during Multiple Reflow

Solder interconnection in three-dimensional (3D) electronic packaging is required to undergo multiple reflow cycles of the soldering process. This paper elucidates the effects of multiple reflow cycles on the solder joints of Sn-3.0Ag-0.5Cu (SAC305) lead (Pb)-free solder with the addition of 1.0 wt....

Descripción completa

Detalles Bibliográficos
Autores principales: Zaimi, Nur Syahirah Mohamad, Salleh, Mohd Arif Anuar Mohd, Abdullah, Mohd Mustafa Al-Bakri, Nadzri, Nur Izzati Muhammad, Sandu, Andrei Victor, Vizureanu, Petrica, Ramli, Mohd Izrul Izwan, Nogita, Kazuhiro, Yasuda, Hideyuki, Sandu, Ioan Gabriel
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9029271/
https://www.ncbi.nlm.nih.gov/pubmed/35454450
http://dx.doi.org/10.3390/ma15082758

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9029271/
https://www.ncbi.nlm.nih.gov/pubmed/35454450
http://dx.doi.org/10.3390/ma15082758

Ejemplares similares