A Comparative Analysis of Printed Circuit Boards with Surface-Mounted and Embedded Components under Natural and Forced Convection

This article is dedicated to the research of the physical reliability of electronic devices. It consists of a comparative thermal analysis of the cooling efficiency of a surface-mounted and an embedded component on a printed circuit board. A simulated finite element model of heat distribution over a...

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Detalles Bibliográficos
Autores principales: Korobkov, Maksim, Vasilyev, Fedor, Mozharov, Vladimir
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9029665/
https://www.ncbi.nlm.nih.gov/pubmed/35457938
http://dx.doi.org/10.3390/mi13040634

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9029665/
https://www.ncbi.nlm.nih.gov/pubmed/35457938
http://dx.doi.org/10.3390/mi13040634

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