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A Comparative Analysis of Printed Circuit Boards with Surface-Mounted and Embedded Components under Natural and Forced Convection
This article is dedicated to the research of the physical reliability of electronic devices. It consists of a comparative thermal analysis of the cooling efficiency of a surface-mounted and an embedded component on a printed circuit board. A simulated finite element model of heat distribution over a...
| Autores principales: | , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2022
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9029665/ https://www.ncbi.nlm.nih.gov/pubmed/35457938 http://dx.doi.org/10.3390/mi13040634 |