Enhancement of the Bond Strength and Reduction of Wafer Edge Voids in Hybrid Bonding

The hybrid wafer bonding technique is drawing much interest in relation to three-dimensional integration technology, and its areas of application are expanding from image sensors to semiconductor memory packages. In hybrid bonding, the bond strength and void formation are the main issues influencing...

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Detalles Bibliográficos
Autores principales: Kim, Yeoun-Soo, Nguyen, Thanh Hai, Choa, Sung-Hoon
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9031334/
https://www.ncbi.nlm.nih.gov/pubmed/35457842
http://dx.doi.org/10.3390/mi13040537

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9031334/
https://www.ncbi.nlm.nih.gov/pubmed/35457842
http://dx.doi.org/10.3390/mi13040537

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