Multi-Foci Laser Separation of Sapphire Wafers with Partial Thickness Scanning

With multi-foci laser cutting technology for sapphire wafer separation, the entire cross-section is generally scanned with single or multiple passes. This investigation proposes a new separation technique through partial thickness scanning. The energy effectivity and efficiency of the picosecond las...

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Detalles Bibliográficos
Autores principales: Lye, Celescia Siew Mun, Wang, Zhongke, Lam, Yee Cheong
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9033070/
https://www.ncbi.nlm.nih.gov/pubmed/35457810
http://dx.doi.org/10.3390/mi13040506

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9033070/
https://www.ncbi.nlm.nih.gov/pubmed/35457810
http://dx.doi.org/10.3390/mi13040506

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