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Multi-Foci Laser Separation of Sapphire Wafers with Partial Thickness Scanning
With multi-foci laser cutting technology for sapphire wafer separation, the entire cross-section is generally scanned with single or multiple passes. This investigation proposes a new separation technique through partial thickness scanning. The energy effectivity and efficiency of the picosecond las...
| Autores principales: | , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2022
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9033070/ https://www.ncbi.nlm.nih.gov/pubmed/35457810 http://dx.doi.org/10.3390/mi13040506 |