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Enhanced reliability of phase-change memory via modulation of local structure and chemical bonding by incorporating carbon in Ge(2)Sb(2)Te(5)

In this study, we investigated the effect of phase-change characteristics on the device performance of carbon-incorporated Ge(2)Sb(2)Te(5) (CGST) to understand the origin of the enhanced reliability and stabilization of the device. Macroscopic and microscopic measurements confirmed that the structur...

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Detalles Bibliográficos
Autores principales: Han, Jeong Hwa, Jeong, Hun, Park, Hanjin, Kwon, Hoedon, Kim, Dasol, Lim, Donghyeok, Baik, Seung Jae, Kwon, Young-Kyun, Cho, Mann-Ho
Formato: Online Artículo Texto
Lenguaje:English
Publicado: The Royal Society of Chemistry 2021
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9034215/
https://www.ncbi.nlm.nih.gov/pubmed/35480803
http://dx.doi.org/10.1039/d1ra02210e
Descripción
Sumario:In this study, we investigated the effect of phase-change characteristics on the device performance of carbon-incorporated Ge(2)Sb(2)Te(5) (CGST) to understand the origin of the enhanced reliability and stabilization of the device. Macroscopic and microscopic measurements confirmed that the structural stability significantly increased with the incorporation of as much as 10% carbon. After the completion of bond formation between C and Ge, the excess C (>5 atomic%) engages in bonding with Sb in localized regions because of the difference in formation energy. These bonds of C with Ge and Sb induce non-uniform local charge density of the short-range order. Finally, because the strong bonds between Ge and C shorten the short Ge–Te bonds, the high thermal stability of CGST relative to that of GST can be attributed to intensified Peierls distortion. The formation of strong bonds successfully underpins the local structures and reduces the stochastic effect. Moreover, extension of the C bonding to Sb enhances the structural reliability, resulting in highly stable CGST in the amorphous phase. Finally, the device stability of CGST in the reset state of the amorphous structure during the device switching process was significantly improved.