Facile fabrication and low-temperature bonding of Cu@Sn–Bi core–shell particles for conductive pastes

The rapid development of flexible wearable electronics arouses huge demand for low-temperature sintering metal inks applied to temperature-sensitive substrates. The high sintering temperature and easy oxidation limited the application of Cu-based pastes. A two-step method involving liquid co-reducti...

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Detalles Bibliográficos
Autores principales: Yang, Zhehan, Pan, Yi, Zhao, Hengyu, Yang, Xiangmin, Liang, Ying, Zhang, Zhen, Fang, Bin
Formato: Online Artículo Texto
Lenguaje:English
Publicado: The Royal Society of Chemistry 2021
Materias:
Chemistry
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9037467/
https://www.ncbi.nlm.nih.gov/pubmed/35479432
http://dx.doi.org/10.1039/d1ra02514g

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9037467/
https://www.ncbi.nlm.nih.gov/pubmed/35479432
http://dx.doi.org/10.1039/d1ra02514g

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