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Facile fabrication and low-temperature bonding of Cu@Sn–Bi core–shell particles for conductive pastes
The rapid development of flexible wearable electronics arouses huge demand for low-temperature sintering metal inks applied to temperature-sensitive substrates. The high sintering temperature and easy oxidation limited the application of Cu-based pastes. A two-step method involving liquid co-reducti...
| Autores principales: | , , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
The Royal Society of Chemistry
2021
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9037467/ https://www.ncbi.nlm.nih.gov/pubmed/35479432 http://dx.doi.org/10.1039/d1ra02514g |