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ALD Al(2)O(3) gate dielectric on the reduction of interface trap density and the enhanced photo-electric performance of IGO TFT
The amorphous indium gallium oxide thin film transistor was fabricated using a cosputtering method. Two samples with different gate dielectric layers were used as follows: sample A with a SiO(2) dielectric layer; and sample B with an Al(2)O(3) dielectric layer. The influence of the gate dielectrics...
Autores principales: | , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
The Royal Society of Chemistry
2020
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9050226/ https://www.ncbi.nlm.nih.gov/pubmed/35498582 http://dx.doi.org/10.1039/d0ra00123f |
Sumario: | The amorphous indium gallium oxide thin film transistor was fabricated using a cosputtering method. Two samples with different gate dielectric layers were used as follows: sample A with a SiO(2) dielectric layer; and sample B with an Al(2)O(3) dielectric layer. The influence of the gate dielectrics on the electric and photo performance has been investigated. Atomic layer deposition deposited the dense film with low interface trapping density and effectively increased drain current. Therefore, sample B exhibited optimal parameters, with an I(on)/I(off) ratio of 7.39 × 10(7), the subthreshold swing of 0.096 V dec(−1), and μ(FE) of 5.36 cm(2) V(−1) s(−1). For ultraviolet (UV) detection, the UV-to-visible rejection ratio of the device was 3 × 10(5), and the photoresponsivity was 0.38 A W(−1) at the V(GS) of −5 V. |
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