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ALD Al(2)O(3) gate dielectric on the reduction of interface trap density and the enhanced photo-electric performance of IGO TFT

The amorphous indium gallium oxide thin film transistor was fabricated using a cosputtering method. Two samples with different gate dielectric layers were used as follows: sample A with a SiO(2) dielectric layer; and sample B with an Al(2)O(3) dielectric layer. The influence of the gate dielectrics...

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Detalles Bibliográficos
Autores principales: Chen, Kuan-Yu, Yang, Chih-Chiang, Huang, Chun-Yuan, Su, Yan-Kuin
Formato: Online Artículo Texto
Lenguaje:English
Publicado: The Royal Society of Chemistry 2020
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9050226/
https://www.ncbi.nlm.nih.gov/pubmed/35498582
http://dx.doi.org/10.1039/d0ra00123f
Descripción
Sumario:The amorphous indium gallium oxide thin film transistor was fabricated using a cosputtering method. Two samples with different gate dielectric layers were used as follows: sample A with a SiO(2) dielectric layer; and sample B with an Al(2)O(3) dielectric layer. The influence of the gate dielectrics on the electric and photo performance has been investigated. Atomic layer deposition deposited the dense film with low interface trapping density and effectively increased drain current. Therefore, sample B exhibited optimal parameters, with an I(on)/I(off) ratio of 7.39 × 10(7), the subthreshold swing of 0.096 V dec(−1), and μ(FE) of 5.36 cm(2) V(−1) s(−1). For ultraviolet (UV) detection, the UV-to-visible rejection ratio of the device was 3 × 10(5), and the photoresponsivity was 0.38 A W(−1) at the V(GS) of −5 V.