Laser slice thinning of GaN-on-GaN high electron mobility transistors

As a newly developed technique to slice GaN substrates, which are currently very expensive, with less loss, we previously reported a laser slicing technique in this journal. In the previous report, from the perspective of GaN substrate processing, we could only show that the GaN substrate could be s...

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Detalles Bibliográficos
Autores principales: Tanaka, Atsushi, Sugiura, Ryuji, Kawaguchi, Daisuke, Wani, Yotaro, Watanabe, Hirotaka, Sena, Hadi, Ando, Yuto, Honda, Yoshio, Igasaki, Yasunori, Wakejima, Akio, Ando, Yuji, Amano, Hiroshi
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9072382/
https://www.ncbi.nlm.nih.gov/pubmed/35513412
http://dx.doi.org/10.1038/s41598-022-10610-4

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9072382/
https://www.ncbi.nlm.nih.gov/pubmed/35513412
http://dx.doi.org/10.1038/s41598-022-10610-4

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