Interface tailoring through the supply of optimized oxygen and hydrogen to semiconductors for highly stable top-gate-structured high-mobility oxide thin-film transistors

Self-aligned structured oxide thin-film transistors (TFTs) are appropriate candidates for use in the backplanes of high-end displays. Although SiN(x) is an appropriate candidate for use in the gate insulators (GIs) of high-performance driving TFTs, direct deposition of SiN(x) on top of high-mobility oxide semiconductors is impossible due to significant hydrogen (H) incorporation. In this study, we used AlO(x) deposited by thermal atomic layer deposition (T-ALD) as the first GI, as it has good H barrier characteristics. During the T-ALD, however, a small amount of H from H(2)O can also be incorporated into the adjacent active layer. In here, we performed O(2) or N(2)O plasma treatment just prior to the T-ALD process to control the carrier density, and utilized H to passivate the defects rather than generate free carriers. While the TFT fabricated without plasma treatment exhibited conductive characteristics, both O(2) and N(2)O plasma-treated TFTs exhibited good transfer characteristics, with a V(th) of 2 V and high mobility (∼30 cm(2) V(−1) s(−1)). Although the TFT with a plasma-enhanced atomic layer deposited (PE-ALD) GI exhibited reasonable on/off characteristics, even without any plasma treatment, it exhibited poor stability. In contrast, the O(2) plasma-treated TFT with T-ALD GI exhibited outstanding stability, i.e., a V(th) shift of 0.23 V under positive-bias temperature stress for 10 ks and a current decay of 1.2% under current stress for 3 ks. Therefore, the T-ALD process for GI deposition can be adopted to yield high-mobility, high-stability top-gate-structured oxide TFTs under O(2) or N(2)O plasma treatment.