Protocol on the fabrication of monocrystalline thin semiconductor via crack-assisted layer exfoliation technique for photoelectrochemical water-splitting

Thin semiconductors attract huge interest due to their cost-effective, flexible, lightweight, and semi-transparent properties. Here, we present a protocol on the preparation of thin semiconductor via controlled crack-assisted layer exfoliation technique. The protocol details the fabrication procedur...

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Detalles Bibliográficos
Autores principales: Lee, Yonghwan, Gupta, Bikesh, Tan, Hark H., Jagadish, Chennupati, Oh, Jihun, Karuturi, Siva
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Elsevier 2022
Materias:
Protocol
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9076963/
https://www.ncbi.nlm.nih.gov/pubmed/35535167
http://dx.doi.org/10.1016/j.xpro.2021.101015

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9076963/
https://www.ncbi.nlm.nih.gov/pubmed/35535167
http://dx.doi.org/10.1016/j.xpro.2021.101015

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