A rapid and cost-effective metallization technique for 3C–SiC MEMS using direct wire bonding

This paper presents a simple, rapid and cost-effective wire bonding technique for single crystalline silicon carbide (3C–SiC) MEMS devices. Utilizing direct ultrasonic wedge–wedge bonding, we have demonstrated for the first time the direct bonding of aluminum wires onto SiC films for the characteriz...

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Detalles Bibliográficos
Autores principales: Md Foisal, Abu Riduan, Phan, Hoang-Phuong, Dinh, Toan, Nguyen, Tuan-Khoa, Nguyen, Nam-Trung, Dao, Dzung Viet
Formato: Online Artículo Texto
Lenguaje:English
Publicado: The Royal Society of Chemistry 2018
Materias:
Chemistry
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9079978/
https://www.ncbi.nlm.nih.gov/pubmed/35539501
http://dx.doi.org/10.1039/c8ra00734a

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9079978/
https://www.ncbi.nlm.nih.gov/pubmed/35539501
http://dx.doi.org/10.1039/c8ra00734a

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