Thermal transport analysis of six circular microchannel heat sink using nanofluid

Electronics devices growth in the last decade of the twentieth century ushered in a revolution inside the electronics segment. Continuous micro-sizes and operation cause these devices to heat up, resulting in a reduction in their performance or damage to their parts. Because heat can decrease device...

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Detalles Bibliográficos
Autores principales: Waqas, Hassan, Khan, Shan Ali, Farooq, Umar, Muhammad, Taseer, Alshehri, Ahmad, Yasmin, Sumeira
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9110377/
https://www.ncbi.nlm.nih.gov/pubmed/35577798
http://dx.doi.org/10.1038/s41598-022-11121-y

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9110377/
https://www.ncbi.nlm.nih.gov/pubmed/35577798
http://dx.doi.org/10.1038/s41598-022-11121-y

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