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Thermal transport analysis of six circular microchannel heat sink using nanofluid
Electronics devices growth in the last decade of the twentieth century ushered in a revolution inside the electronics segment. Continuous micro-sizes and operation cause these devices to heat up, resulting in a reduction in their performance or damage to their parts. Because heat can decrease device...
| Autores principales: | , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Nature Publishing Group UK
2022
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9110377/ https://www.ncbi.nlm.nih.gov/pubmed/35577798 http://dx.doi.org/10.1038/s41598-022-11121-y |