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Deep Etching of Silicon Based on Metal-Assisted Chemical Etching

[Image: see text] A deep etching method for silicon “micro”structures was successfully developed. This wet etching process is based on metal-assisted chemical etching (MACE), which was previously mainly utilized to etch the features that have lateral dimensions of “nanometers.” In this novel MACE, t...

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Detalles Bibliográficos
Autores principales: Nur’aini, Anafi, Oh, Ilwhan
Formato: Online Artículo Texto
Lenguaje:English
Publicado: American Chemical Society 2022
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9118418/
https://www.ncbi.nlm.nih.gov/pubmed/35601341
http://dx.doi.org/10.1021/acsomega.2c01113