Enhancement of Mechanical and Bond Properties of Epoxy Adhesives Modified by SiO(2) Nanoparticles with Active Groups

In order to improve the mechanical and bond properties of epoxy adhesives for their wide scope of applications, modified epoxy adhesives were produced in this study with SiO(2) nanoparticles of 20 nm in size, including inactive groups, NH(2) active groups, and C(4)H(8) active groups. The mechanical...

Descripción completa

Detalles Bibliográficos
Autores principales: Long, Jiejie, Li, Chuanxi, Li, You
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9143029/
https://www.ncbi.nlm.nih.gov/pubmed/35631934
http://dx.doi.org/10.3390/polym14102052

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9143029/
https://www.ncbi.nlm.nih.gov/pubmed/35631934
http://dx.doi.org/10.3390/polym14102052

Ejemplares similares