Fast Filling of Microvia by Pre-Settling Particles and Following Cu Electroplating

Microvia interconnectors are a critical element of 3D packaging technology, as they provide the shortest interconnection path between stacked chips. However, low efficiency of microvia filling is a long-standing problem. This study proposed a two-step method to enhance the electroplating filling eff...

Descripción completa

Detalles Bibliográficos
Autores principales: Li, Ganglong, Li, Zhiyi, Li, Junjie, Wu, Houya
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Communication
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9143643/
https://www.ncbi.nlm.nih.gov/pubmed/35630921
http://dx.doi.org/10.3390/nano12101699

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9143643/
https://www.ncbi.nlm.nih.gov/pubmed/35630921
http://dx.doi.org/10.3390/nano12101699

Ejemplares similares