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Fast Filling of Microvia by Pre-Settling Particles and Following Cu Electroplating
Microvia interconnectors are a critical element of 3D packaging technology, as they provide the shortest interconnection path between stacked chips. However, low efficiency of microvia filling is a long-standing problem. This study proposed a two-step method to enhance the electroplating filling eff...
Autores principales: | , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2022
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9143643/ https://www.ncbi.nlm.nih.gov/pubmed/35630921 http://dx.doi.org/10.3390/nano12101699 |
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author | Li, Ganglong Li, Zhiyi Li, Junjie Wu, Houya |
author_facet | Li, Ganglong Li, Zhiyi Li, Junjie Wu, Houya |
author_sort | Li, Ganglong |
collection | PubMed |
description | Microvia interconnectors are a critical element of 3D packaging technology, as they provide the shortest interconnection path between stacked chips. However, low efficiency of microvia filling is a long-standing problem. This study proposed a two-step method to enhance the electroplating filling efficiency by pre-setting metal particles in microvias and later electroplating the Cu to fill the gaps among the pre-settled particles. Since these particles occupy a certain volume in the microvia, less electroplating Cu is needed for microvia filling, leading to a shorter electroplating period. |
format | Online Article Text |
id | pubmed-9143643 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2022 |
publisher | MDPI |
record_format | MEDLINE/PubMed |
spelling | pubmed-91436432022-05-29 Fast Filling of Microvia by Pre-Settling Particles and Following Cu Electroplating Li, Ganglong Li, Zhiyi Li, Junjie Wu, Houya Nanomaterials (Basel) Communication Microvia interconnectors are a critical element of 3D packaging technology, as they provide the shortest interconnection path between stacked chips. However, low efficiency of microvia filling is a long-standing problem. This study proposed a two-step method to enhance the electroplating filling efficiency by pre-setting metal particles in microvias and later electroplating the Cu to fill the gaps among the pre-settled particles. Since these particles occupy a certain volume in the microvia, less electroplating Cu is needed for microvia filling, leading to a shorter electroplating period. MDPI 2022-05-16 /pmc/articles/PMC9143643/ /pubmed/35630921 http://dx.doi.org/10.3390/nano12101699 Text en © 2022 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). |
spellingShingle | Communication Li, Ganglong Li, Zhiyi Li, Junjie Wu, Houya Fast Filling of Microvia by Pre-Settling Particles and Following Cu Electroplating |
title | Fast Filling of Microvia by Pre-Settling Particles and Following Cu Electroplating |
title_full | Fast Filling of Microvia by Pre-Settling Particles and Following Cu Electroplating |
title_fullStr | Fast Filling of Microvia by Pre-Settling Particles and Following Cu Electroplating |
title_full_unstemmed | Fast Filling of Microvia by Pre-Settling Particles and Following Cu Electroplating |
title_short | Fast Filling of Microvia by Pre-Settling Particles and Following Cu Electroplating |
title_sort | fast filling of microvia by pre-settling particles and following cu electroplating |
topic | Communication |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9143643/ https://www.ncbi.nlm.nih.gov/pubmed/35630921 http://dx.doi.org/10.3390/nano12101699 |
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