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Fast Filling of Microvia by Pre-Settling Particles and Following Cu Electroplating

Microvia interconnectors are a critical element of 3D packaging technology, as they provide the shortest interconnection path between stacked chips. However, low efficiency of microvia filling is a long-standing problem. This study proposed a two-step method to enhance the electroplating filling eff...

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Detalles Bibliográficos
Autores principales: Li, Ganglong, Li, Zhiyi, Li, Junjie, Wu, Houya
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9143643/
https://www.ncbi.nlm.nih.gov/pubmed/35630921
http://dx.doi.org/10.3390/nano12101699
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author Li, Ganglong
Li, Zhiyi
Li, Junjie
Wu, Houya
author_facet Li, Ganglong
Li, Zhiyi
Li, Junjie
Wu, Houya
author_sort Li, Ganglong
collection PubMed
description Microvia interconnectors are a critical element of 3D packaging technology, as they provide the shortest interconnection path between stacked chips. However, low efficiency of microvia filling is a long-standing problem. This study proposed a two-step method to enhance the electroplating filling efficiency by pre-setting metal particles in microvias and later electroplating the Cu to fill the gaps among the pre-settled particles. Since these particles occupy a certain volume in the microvia, less electroplating Cu is needed for microvia filling, leading to a shorter electroplating period.
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spelling pubmed-91436432022-05-29 Fast Filling of Microvia by Pre-Settling Particles and Following Cu Electroplating Li, Ganglong Li, Zhiyi Li, Junjie Wu, Houya Nanomaterials (Basel) Communication Microvia interconnectors are a critical element of 3D packaging technology, as they provide the shortest interconnection path between stacked chips. However, low efficiency of microvia filling is a long-standing problem. This study proposed a two-step method to enhance the electroplating filling efficiency by pre-setting metal particles in microvias and later electroplating the Cu to fill the gaps among the pre-settled particles. Since these particles occupy a certain volume in the microvia, less electroplating Cu is needed for microvia filling, leading to a shorter electroplating period. MDPI 2022-05-16 /pmc/articles/PMC9143643/ /pubmed/35630921 http://dx.doi.org/10.3390/nano12101699 Text en © 2022 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
spellingShingle Communication
Li, Ganglong
Li, Zhiyi
Li, Junjie
Wu, Houya
Fast Filling of Microvia by Pre-Settling Particles and Following Cu Electroplating
title Fast Filling of Microvia by Pre-Settling Particles and Following Cu Electroplating
title_full Fast Filling of Microvia by Pre-Settling Particles and Following Cu Electroplating
title_fullStr Fast Filling of Microvia by Pre-Settling Particles and Following Cu Electroplating
title_full_unstemmed Fast Filling of Microvia by Pre-Settling Particles and Following Cu Electroplating
title_short Fast Filling of Microvia by Pre-Settling Particles and Following Cu Electroplating
title_sort fast filling of microvia by pre-settling particles and following cu electroplating
topic Communication
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9143643/
https://www.ncbi.nlm.nih.gov/pubmed/35630921
http://dx.doi.org/10.3390/nano12101699
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AT wuhouya fastfillingofmicroviabypresettlingparticlesandfollowingcuelectroplating