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Fast Filling of Microvia by Pre-Settling Particles and Following Cu Electroplating
Microvia interconnectors are a critical element of 3D packaging technology, as they provide the shortest interconnection path between stacked chips. However, low efficiency of microvia filling is a long-standing problem. This study proposed a two-step method to enhance the electroplating filling eff...
| Autores principales: | , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2022
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9143643/ https://www.ncbi.nlm.nih.gov/pubmed/35630921 http://dx.doi.org/10.3390/nano12101699 |