Co-W Barrier Layers for Metallization of Copper Interconnects: Thermal Performance Analysis

The back-end-of-line (BEOL) copper interconnect structure has been subjected to downscaling for the last two decades, while the materials used for conforming and assuring its physical integrity during processing have faced significant obstacles as the single-digit nanometer process node is implement...

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Detalles Bibliográficos
Autores principales: Oliveira, Bruno M. C., Santos, Ruben F., Piedade, Ana P., Ferreira, Paulo J., Vieira, Manuel F.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9144600/
https://www.ncbi.nlm.nih.gov/pubmed/35630972
http://dx.doi.org/10.3390/nano12101752

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9144600/
https://www.ncbi.nlm.nih.gov/pubmed/35630972
http://dx.doi.org/10.3390/nano12101752

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