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Co-W Barrier Layers for Metallization of Copper Interconnects: Thermal Performance Analysis
The back-end-of-line (BEOL) copper interconnect structure has been subjected to downscaling for the last two decades, while the materials used for conforming and assuring its physical integrity during processing have faced significant obstacles as the single-digit nanometer process node is implement...
| Autores principales: | , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2022
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9144600/ https://www.ncbi.nlm.nih.gov/pubmed/35630972 http://dx.doi.org/10.3390/nano12101752 |