1-(4-Hydroxyphenyl)-2H-tetrazole-5-thione as a leveler for acid copper electroplating of microvia

Microvia filling by copper electroplating was performed using plating solution with 1-(4-hydroxyphenyl)-2H-tetrazole-5-thione (HPTT) as the leveler. Galvanostatic Measurements (GMs), Linear Sweep Voltammetry (LSV) and Electrochemical Impedance Spectroscopy (EIS) tests were carried out to investigate...

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Detalles Bibliográficos
Autores principales: Teng, Xulingjie, Tao, Zhihua, Long, Zhiyuan, Liu, Guanting, Tao, Xuefei
Formato: Online Artículo Texto
Lenguaje:English
Publicado: The Royal Society of Chemistry 2022
Materias:
Chemistry
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9152711/
https://www.ncbi.nlm.nih.gov/pubmed/35733656
http://dx.doi.org/10.1039/d2ra02274e

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9152711/
https://www.ncbi.nlm.nih.gov/pubmed/35733656
http://dx.doi.org/10.1039/d2ra02274e

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