Cargando…
1-(4-Hydroxyphenyl)-2H-tetrazole-5-thione as a leveler for acid copper electroplating of microvia
Microvia filling by copper electroplating was performed using plating solution with 1-(4-hydroxyphenyl)-2H-tetrazole-5-thione (HPTT) as the leveler. Galvanostatic Measurements (GMs), Linear Sweep Voltammetry (LSV) and Electrochemical Impedance Spectroscopy (EIS) tests were carried out to investigate...
| Autores principales: | , , , , |
|---|---|
| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
The Royal Society of Chemistry
2022
|
| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9152711/ https://www.ncbi.nlm.nih.gov/pubmed/35733656 http://dx.doi.org/10.1039/d2ra02274e |