Predicting Wafer-Level Package Reliability Life Using Mixed Supervised and Unsupervised Machine Learning Algorithms

With the increasing demand for electronic products, the electronic package gradually developed toward miniaturization and high density. The most significant advantage of the Wafer-Level Package (WLP) is that it can effectively reduce the volume and footprint area of the package. An important issue i...

Descripción completa

Detalles Bibliográficos
Autores principales: Su, Qing-Hua, Chiang, Kuo-Ning
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9182149/
https://www.ncbi.nlm.nih.gov/pubmed/35683193
http://dx.doi.org/10.3390/ma15113897

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9182149/
https://www.ncbi.nlm.nih.gov/pubmed/35683193
http://dx.doi.org/10.3390/ma15113897

Ejemplares similares