Assessment of Strains Produced by Thermal Expansion in Printed Circuit Boards

The paper proposed an alternative optical metrology to classical methods (strain gauge measurements and numerical simulation) for strain determination on printed circuit board (PCBs) due to thermal loads. The digital image correlation (DIC) technique was employed to record the strain distribution in...

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Detalles Bibliográficos
Autores principales: Falk, Alexandru, Pop, Octavian, Dopeux, Jérôme, Marsavina, Liviu
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9182349/
https://www.ncbi.nlm.nih.gov/pubmed/35683213
http://dx.doi.org/10.3390/ma15113916

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9182349/
https://www.ncbi.nlm.nih.gov/pubmed/35683213
http://dx.doi.org/10.3390/ma15113916

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