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Assessment of Strains Produced by Thermal Expansion in Printed Circuit Boards
The paper proposed an alternative optical metrology to classical methods (strain gauge measurements and numerical simulation) for strain determination on printed circuit board (PCBs) due to thermal loads. The digital image correlation (DIC) technique was employed to record the strain distribution in...
| Autores principales: | , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2022
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9182349/ https://www.ncbi.nlm.nih.gov/pubmed/35683213 http://dx.doi.org/10.3390/ma15113916 |