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Application of Three-Repetition Tests Scheme to Improve Integrated Circuits Test Quality to Near-Zero Defect
In this research, the normal distribution is assumed to be the product characteristic, and the DITM (Digital Integrated Circuit Test Model) model is used to evaluate the integrated circuits (IC) test yield and test quality. Testing technology lags far behind manufacturing technology due to the diffe...
Autores principales: | , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2022
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9185298/ https://www.ncbi.nlm.nih.gov/pubmed/35684779 http://dx.doi.org/10.3390/s22114158 |
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author | Yeh, Chung-Huang Chen, Jwu-E |
author_facet | Yeh, Chung-Huang Chen, Jwu-E |
author_sort | Yeh, Chung-Huang |
collection | PubMed |
description | In this research, the normal distribution is assumed to be the product characteristic, and the DITM (Digital Integrated Circuit Test Model) model is used to evaluate the integrated circuits (IC) test yield and test quality. Testing technology lags far behind manufacturing technology due to the different rates of development of the two technologies. As a result, quality control will pose significant challenges in pursuing high-quality near-zero defect products (automotive and biomedical electronics and avionics, etc.). In order to ensure product quality, we propose an effective repeated testing method (three-repetition tests scheme, TRTS), which utilizes the move test guardband (TGB) to improve the test yield and test quality. Based on the data in the International Roadmap for Devices and Systems table in 2021, the DITM model is used to estimate the future trend of semiconductor chip test yield, and the retest method (TRTS) is applied improve the test results. The method of repeated testing can increase the test yield and increase the shipment of semiconductor products. By estimating the test cost and profit, the method of repeated testing can obtain chips with near-zero defects with more corporate profits through increased product shipments. |
format | Online Article Text |
id | pubmed-9185298 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2022 |
publisher | MDPI |
record_format | MEDLINE/PubMed |
spelling | pubmed-91852982022-06-11 Application of Three-Repetition Tests Scheme to Improve Integrated Circuits Test Quality to Near-Zero Defect Yeh, Chung-Huang Chen, Jwu-E Sensors (Basel) Article In this research, the normal distribution is assumed to be the product characteristic, and the DITM (Digital Integrated Circuit Test Model) model is used to evaluate the integrated circuits (IC) test yield and test quality. Testing technology lags far behind manufacturing technology due to the different rates of development of the two technologies. As a result, quality control will pose significant challenges in pursuing high-quality near-zero defect products (automotive and biomedical electronics and avionics, etc.). In order to ensure product quality, we propose an effective repeated testing method (three-repetition tests scheme, TRTS), which utilizes the move test guardband (TGB) to improve the test yield and test quality. Based on the data in the International Roadmap for Devices and Systems table in 2021, the DITM model is used to estimate the future trend of semiconductor chip test yield, and the retest method (TRTS) is applied improve the test results. The method of repeated testing can increase the test yield and increase the shipment of semiconductor products. By estimating the test cost and profit, the method of repeated testing can obtain chips with near-zero defects with more corporate profits through increased product shipments. MDPI 2022-05-30 /pmc/articles/PMC9185298/ /pubmed/35684779 http://dx.doi.org/10.3390/s22114158 Text en © 2022 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). |
spellingShingle | Article Yeh, Chung-Huang Chen, Jwu-E Application of Three-Repetition Tests Scheme to Improve Integrated Circuits Test Quality to Near-Zero Defect |
title | Application of Three-Repetition Tests Scheme to Improve Integrated Circuits Test Quality to Near-Zero Defect |
title_full | Application of Three-Repetition Tests Scheme to Improve Integrated Circuits Test Quality to Near-Zero Defect |
title_fullStr | Application of Three-Repetition Tests Scheme to Improve Integrated Circuits Test Quality to Near-Zero Defect |
title_full_unstemmed | Application of Three-Repetition Tests Scheme to Improve Integrated Circuits Test Quality to Near-Zero Defect |
title_short | Application of Three-Repetition Tests Scheme to Improve Integrated Circuits Test Quality to Near-Zero Defect |
title_sort | application of three-repetition tests scheme to improve integrated circuits test quality to near-zero defect |
topic | Article |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9185298/ https://www.ncbi.nlm.nih.gov/pubmed/35684779 http://dx.doi.org/10.3390/s22114158 |
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